µPOL Chip-Embedded DC-DC Power Modules
TDK μPOL DC-DC converters are compact and highly integrated point-of-load converters for powering CPUs, MCUs, ASICs, FPGAs, DSP, and other advanced digital logic devices, providing the high performance, fast load transient response, and high accuracy voltage regulation needed by these devices. Micro-POL converters are high current density power modules that feature a chip-embedded power IC in a thermally enhanced semiconductor-embedded-in-substrate package.
Product Overview
Application Note & Reference Designs
FPGA & SoC Solutions
Power Solutions Cookbook
View Full Product Presentation
Product Library
Browse Application Note
Next-Generation Vertical Power Design for Compact and High-Performance FPGA, SoC, and ASIC
Product Overview
Application Note & Reference Designs
AI and edge devices are pushing the limits of performance and power density. Discover how TDK’s μPOL vertical power supply architecture solves space and thermal challenges in next-gen designs.
Traditional Power Solution
Vertical Power Solution
Compare
FPGA & SoC Solutions
Why Vertical power?
Power Solutions Cookbook
Product Library
Search Reference Designs
FPGA & SoC Solutions:
TDK micro-POL DC-DC Quick Power Solutions for FPGAs/SoCs
Click to get started
Product Overview
Application Note & Reference Designs
FPGA & SoC Solutions
Power Solutions Cookbook
Product Library
µPOL Embedded DC-DC Converters
Product Overview
View Product Modules
Application Note & Reference Designs
FPGA & SoC Solutions
Power Solutions Cookbook
Product Library
Power Solutions Cookbook
Various FPGAs / SoCs, multi-ARM SoCs
What's Inside?
This tactical resource delivers ready-to-use starter designs, power maps, schematics, BOMs, and PCB layouts for a wide range of FPGA, SoC, ASIC, and Ethernet chipsets. It spans from low‑power Artix to high-density Zynq UltraScale+, Arria, Stratix, Agilex, and more—supporting current ranges from a few amps up to 200 A.
Product Overview
Application Note & Reference Designs
Read Now
FPGA & SoC Solutions
Power Solutions Cookbook
Product Library
The Need for Vertical
As AI and broadband edge applications demand more computing power in less space, traditional discrete power architectures fall short. TDK’s μPOL vertical power solutions, built on chip-embedded SESUB technology, deliver high-density DC-DC power from 1A to 200A—ideal for SoCs, FPGAs, and ASICs requiring core, auxiliary, and high-speed serializer voltages in space-constrained designs.
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Transcript
µPOL Chip-Embedded DC-DC Power Modules
TDK μPOL DC-DC converters are compact and highly integrated point-of-load converters for powering CPUs, MCUs, ASICs, FPGAs, DSP, and other advanced digital logic devices, providing the high performance, fast load transient response, and high accuracy voltage regulation needed by these devices. Micro-POL converters are high current density power modules that feature a chip-embedded power IC in a thermally enhanced semiconductor-embedded-in-substrate package.
Product Overview
Application Note & Reference Designs
FPGA & SoC Solutions
Power Solutions Cookbook
View Full Product Presentation
Product Library
Browse Application Note
Next-Generation Vertical Power Design for Compact and High-Performance FPGA, SoC, and ASIC
Product Overview
Application Note & Reference Designs
AI and edge devices are pushing the limits of performance and power density. Discover how TDK’s μPOL vertical power supply architecture solves space and thermal challenges in next-gen designs.
Traditional Power Solution
Vertical Power Solution
Compare
FPGA & SoC Solutions
Why Vertical power?
Power Solutions Cookbook
Product Library
Search Reference Designs
FPGA & SoC Solutions:
TDK micro-POL DC-DC Quick Power Solutions for FPGAs/SoCs
Click to get started
Product Overview
Application Note & Reference Designs
FPGA & SoC Solutions
Power Solutions Cookbook
Product Library
µPOL Embedded DC-DC Converters
Product Overview
View Product Modules
Application Note & Reference Designs
FPGA & SoC Solutions
Power Solutions Cookbook
Product Library
Power Solutions Cookbook
Various FPGAs / SoCs, multi-ARM SoCs
What's Inside?
This tactical resource delivers ready-to-use starter designs, power maps, schematics, BOMs, and PCB layouts for a wide range of FPGA, SoC, ASIC, and Ethernet chipsets. It spans from low‑power Artix to high-density Zynq UltraScale+, Arria, Stratix, Agilex, and more—supporting current ranges from a few amps up to 200 A.
Product Overview
Application Note & Reference Designs
Read Now
FPGA & SoC Solutions
Power Solutions Cookbook
Product Library
The Need for Vertical
As AI and broadband edge applications demand more computing power in less space, traditional discrete power architectures fall short. TDK’s μPOL vertical power solutions, built on chip-embedded SESUB technology, deliver high-density DC-DC power from 1A to 200A—ideal for SoCs, FPGAs, and ASICs requiring core, auxiliary, and high-speed serializer voltages in space-constrained designs.
Continue Reading