The latest infographic from Vishay details how you can enhance your next design with DFN, eSMP®, and FlatPAK package diodes and rectifiers. DFN packages maximize miniaturization by minimizing thermal resistance and optimizing die size. Their leadless design provides AOI support. eSMP packages offer a substantial reduction in profile to 1 mm while achieving high current/power density for significant miniaturization. FlatPak packages provide two different technologies in one 5 x 6 package and save PCB space.